WETTING OF SILICON NITRIDE BY COPPER-TITANIUM OR COPPER-ZIRCONIUM ALLOYS.

The sessile drop technique has been used to measure the contact angle of molten copper-0-60 at% titanium or copper-0-60 at% zirconium alloys with Si//3N//4 as a function of time and temperature over the range 900 degree C to 1100 degree C using time-lapse photography in vacuum condition. The temperature dependence of contact angle of copper alloys containing 30 at% titanium or more is large although the dependence of alloys containing 20 at% titanium is small. The drops of containing 30 at% titanium or more largely spread. Since the time dependence of contact angle of alloys containing 30 at% titanium is quite large, the alloys show photographically small time dependence of the contact angle. On the other hand, the contact angle of Cu-20 at% Ti alloy changes from 40 degree to 10 degree after 120 min holding at 1100 degree C. At 1100 degree C for 30 min the contact angles of alloys containing 30 at% or more titanium show the small value of 8 degree .