Rosin Solder Fluxes.

被引：0

作者：

Wozniakowski, Boguslaw

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来源：

| 1600年 / 14期

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Compendex;

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摘要：

ELECTRONIC EQUIPMENT MANUFACTURE

引用

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Roberts, Kelvin
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1600, (59):
[22] SOLDER CREAMS AND HOW TO USE THEM.
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Electronic Packaging and Production, 1981, 21 (02): : 116 - 133
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Assembly engineering, 1981, 24 (11): : 22 - 24
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Progress in Organic Coatings, 2022, 168
[26] Interface dynamics with heat and mass fluxes
Ilyin, Dan V.
Abarzhi, Snezhana I.
Physics Letters, Section A: General, Atomic and Solid State Physics, 2022, 426
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Kelly, Edward A.
Circuits Manufacturing, 1985, 25 (05): : 64 - 72
[28] RECENT ADVANCES IN SOLDER BOND TECHNOLOGY FOR MICROELECTRONIC PACKAGING
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MORABITO, JM
THIN SOLID FILMS, 1980, 72 (03) : 433 - 442
[29] ACID WELDING FLUXES AND WELD METAL HYDROGEN
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[30] Replacement of the Fluxes in Agglomerated Lead Charges.
Stroitelev, I.A.
Gritsai, V.P.
Shishkin, V.I.
Kubyshev, N.N.
Bulgakov, V.I.
Tsvetnye Metally, 1977, (06): : 17 - 20