SUBSURFACE CIRCUITRY ON POLYMERIC SUBSTRATES.

被引：0

作者：

Mace, E.W.

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来源：

IBM technical disclosure bulletin | 1984年 / 27卷 / 05期

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摘要：

This technique represents a novel, efficient, low-cost, high-production method of fabricating electronic circuits, by featuring polymer thick-film circuitry on an unreinforced or reinforced polymer substrate. The process is amenable to high speed reproducible circuit manufacture.

引用

页码：2937 / 2938