Ball bumping and coining operations for tab and flip chip

被引：0
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作者：
Levine, Lee [1 ]
机构：
[1] Kulicke & Soffa Industries, Inc, Willow Grove, United States
来源：
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 1997年
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摘要：
8
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页码：110 / 112
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