Experimental investigation on heat transfer of miniature flat plate heat pipes

被引：0
|
作者：
Hong, Y.P. [1 ]
Li, Q. [1 ]
Xuan, Y.M. [1 ]
机构：
[1] Sch. of Power Eng., Nanjing Univ. of Sci. and Technol., Nanjing 210094, China
来源：
Nanjing Li Gong Daxue Xuebao/Journal of Nanjing University of Science and Technology | 2001年 / 25卷 / 01期
关键词：
Cooling systems - Electron devices - Heat transfer - Plates (structural components) - Porous materials - Temperature distribution;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This paper develops a flat-plate heat pipe for cooling electronic component of high power. A layer of sintered porous media is applied to the evaporation surface of the FPHP to enhance the heat transfer during the boiling of the working fluid. The transient and steady temperature distribution of the FPHP is measured, the effects of several factors, such as the working fluid filling rate, porous layer filling rate on the performance of the FPHP, are analyzed.
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页码：32 / 35
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