共 50 条
- [41] Advanced ELID process development for grinding silicon wafers Chemical-Mechanical Planarization-Integration, Technology and Reliability, 2005, 867 : 97 - 102
- [42] Rapid thermal processing of silicon wafers with emissivity patterns Journal of Electronic Materials, 2006, 35 : 877 - 891
- [45] Features of Silicon Wafers Eutectic Bonding Technology for MEMS PROCEEDINGS OF THE 2019 IEEE CONFERENCE OF RUSSIAN YOUNG RESEARCHERS IN ELECTRICAL AND ELECTRONIC ENGINEERING (EICONRUS), 2019, : 1995 - 1998
- [48] Applications of polishing technology using polymer particles to silicon wafers and quartz crystal wafers PROGRESS OF PRECISION ENGINEERING AND NANO TECHNOLOGY, 2007, 339 : 263 - +
- [49] Advanced FTIR technology for the chemical characterization of product wafers CHARACTERIZATION AND METROLOGY FOR ULSI TECHNOLOGY 2000, INTERNATIONAL CONFERENCE, 2001, 550 : 553 - 557
- [50] Processing of Ultrathin 300 mm Wafers with Carrierless Technology 2011 IEEE 61ST ELECTRONIC COMPONENTS AND TECHNOLOGY CONFERENCE (ECTC), 2011, : 984 - 988