Core design and system-on-a-chip integration

被引：0
作者：
Rincon, Ann Marie [1 ]
Cherichetti, Cory [1 ]
Monzel, James A. [1 ]
Stauffer, David R. [1 ]
Trick, Michael T. [1 ]
机构：
[1] IBM Microelectronics Corp, Essex Junction, United States
来源：
IEEE Design and Test of Computers | 1997年 / 14卷 / 04期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：26 / 35
相关论文
共 50 条
[41]   RTL techniques for optimizing power in system-on-a-chip design [J].
Frenkil, Jerry ;
Allen, Dave .
Computer Design, 1998, 37 (12)
[42]   The μPP ASIC:: Design, methodologies and tools for a pay phone system-on-a-chip based on an ARM core and design reuse [J].
Riesco, J ;
Díaz, JC ;
Plaza, PI .
PROCEEDINGS OF THE IEEE 1999 CUSTOM INTEGRATED CIRCUITS CONFERENCE, 1999, :635-638
[43]   Nanometer mixed-signal system-on-a-chip design [J].
Chou, EY ;
Sheu, B .
IEEE CIRCUITS & DEVICES, 2002, 18 (04) :7-17
[44]   System-on-a-chip era requires rethinking design approaches [J].
Ussery, C .
COMPUTER DESIGN, 1998, 37 (08) :94-96
[45]   Technology agreement will make system-on-a-chip design easier [J].
不详 .
ELECTRONIC DESIGN, 1997, 45 (17) :28-28
[46]   Issues and strategies for the physical design of system-on-a-chip ASICs [J].
Bednar, T.R. ;
Buffet, P.H. ;
Darden, R.J. ;
Gould, S.W. ;
Zuchowski, P.S. .
1600, IBM Corporation (46)
[47]   A system-on-a-chip for pattern recognition -: Architecture and design methodology [J].
Aberbour, M ;
Mehrez, H ;
Durbin, F ;
Haussy, J ;
Lalande, P ;
Tissot, A .
5TH INTERNATIONAL WORKSHOP ON COMPUTER ARCHITECTURES FOR MACHINE PERCEPTION, PROCEEDINGS, 2000, :155-162
[48]   System-on-a-chip - Preface [J].
Reeves, TM ;
Ravey, TK .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2002, 46 (06) :647-647
[49]   Issues and strategies for the physical design of system-on-a-chip ASICs [J].
Bednar, TR ;
Buffet, PH ;
Darden, RJ ;
Gould, SW ;
Zuchowski, PS .
IBM JOURNAL OF RESEARCH AND DEVELOPMENT, 2002, 46 (06) :661-674
[50]   Architecting voltage islands in core-based System-on-a-Chip designs [J].
Hu, JC ;
Shin, YS ;
Dhanwada, N ;
Marculescu, R .
ISLPED '04: PROCEEDINGS OF THE 2004 INTERNATIONAL SYMPOSIUM ON LOW POWER ELECTRONICS AND DESIGN, 2004, :180-185
12345