Production of microcomponents using thick-film photoresist

被引:0
|
作者
Maciossek, A.
Gruetzner, G.
Reuther, F.
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来源
Galvanotechnik | 2000年 / 91卷 / 07期
关键词
Aspect ratio - Electroforming - Nickel - Silicon - Thick films;
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摘要
Manufacture of microcomponents using thick-film resist with 3D UV micro-forming is a process of growing importance in micro-engineering. Electroforming of structures up to 100 μm in thickness with a resolution of 15 μm can be carried out using high-viscosity Novolak/DNQ resists. To create structures with greater thicknesses of up to 500 μm and aspect ratios of 18:1 and other free-standing structures, chemically-reinforced negative resists can be used. Using the thick-film resists, products such as micro-planar coils made of gold over silicon or mirror arrays of nickel with gold coating formed on a copper substrate, could be produced.
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页码:1988 / 1996
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