New PCB technologies emerge for high-density interconnect

被引：0

作者：

Cookson Electronics, Providence, United States ^{[1
]}

机构：

来源：

Electron Packag Prod | / 4卷 / 75-76, 78期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

共 50 条

[21] Challenges in high-density PCB assembly: New strategies for improving quality inspection and test [J].

De Marco, AI .

SMTA INTERNATIONAL PROCEEDINGS OF THE TECHNICAL PROGRAM, 1999, :473-484

[22] High-density CMOS interconnect realized on flexible organic substrate [J].

Li, HY ;

Hwang, N ;

Guo, LH ;

Zhang, QX ;

Teoh, KW ;

Lo, GQ ;

Balasubraminian, N ;

Kwong, DL .

IEEE ELECTRON DEVICE LETTERS, 2006, 27 (02) :102-104

[23] FILM STRESS IN HIGH-DENSITY THIN-FILM INTERCONNECT [J].

PAN, JT ;

POON, S .

ELECTRONIC PACKAGING MATERIALS SCIENCE IV, 1989, 154 :27-37

[24] Microwave techniques for high-density electronics interconnect bonding and hybridization [J].

Budraa, N ;

Ng, B ;

Wang, D ;

Ahsan, S ;

Zhang, Y ;

Mai, J .

IEEE TRANSACTIONS ON NUCLEAR SCIENCE, 2004, 51 (06) :3038-3042

[25] Demonstration of a high-density parallel-WDM optical interconnect [J].

Ali, ME ;

Panotopoulos, G ;

de Groot, E ;

Flower, GM ;

Rankin, GH ;

Schmit, AJ ;

Djordjev, KD ;

Tan, MRT ;

Tandon, A ;

Gong, W ;

Tella, RP ;

Law, B ;

Chia, LK ;

Dolfi, DW ;

Lemoff, BE .

2004 IEEE LEOS ANNUAL MEETING CONFERENCE PROCEEDINGS, VOLS 1 AND 2, 2004, :459-460

[26] WILL HIGH-DENSITY MEMORIES EMERGE FROM SCANNING-MICROSCOPE EXPERIMENT [J].

GOSCH, J .

ELECTRONIC DESIGN, 1990, 38 (05) :30-32

[27] High-density solder bump interconnect for MEMS hybrid integration [J].

Basavanhally, Nagesh ;

Lopez, Daniel ;

Aksyuk, Vladimir ;

Ramsey, Dave ;

Bower, Eric ;

Cirelli, Ray ;

Ferry, E. ;

Frahm, Robert ;

Gates, John, II ;

Klemens, Fred ;

Lai, Warren ;

Low, Yee ;

Mansfield, William ;

Pai, Chien-Shing ;

Papazian, Rick ;

Pardo, Flavio ;

Sorsch, Tom ;

Watson, Pat .

IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2007, 30 (04) :622-628

[28] HARDWARE AND INTERCONNECT DEVICES - KEYS TO TODAYS HIGH-DENSITY PACKAGING [J].

SNIGIER, P .

EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1976, 21 (22) :192-194

[29] High-density multi-lane connectivity for optical interconnect [J].

Iwaya, Mitsuhiro .

IEEE CPMT SYMPOSIUM JAPAN 2015, (ICSJ 2015), 2015, :160-161

[30] High-density packaging technologies on silicon substrates [J].

Akazawa, M ;

Kuramochi, S ;

Maruyama, T ;

Nakayama, K ;

Takano, A ;

Yamaguchi, M ;

Fukuoka, Y .

53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, :647-651

← 1 2 3 4 5 →