ADHESIVES FOR SMD ASSEMBLY.

被引：0

作者：

Hastie, William M. ^{[1
]}

机构：

[1] Circuits Manufacturing, Boston, MA,, USA, Circuits Manufacturing, Boston, MA, USA

来源：

Circuits Manufacturing | 1985年 / 25卷 / 04期

关键词：

PRINTED CIRCUITS - Components;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Problems in staking or keeping surface mounted devices (SMD) in place on printed circuit boards (PCB) are considered when one of the three basic methods is employed: screening, pin transfer and pressure dispensing. The last one, the most commonly used method in the US today, uses a syringe-like nozzle that controls drop size. The selection of the staking compound, best methods for curing the adhesive, and after-curing processes are discussed.

引用

页码：86 / 92