TESTING THE FLATNESS OF CERAMIC SUBSTRATES.

被引:0
作者
Ford, Donald
机构
来源
Circuits Manufacturing | 1983年 / 23卷 / 05期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
As the hybrid circuit industry uses four different ways to measure flatness of ceramic substrates, the best measurement technique is being sought. Some of the 23 surface deviations listed and defined by the ASTM are illustrated, and the techniques of thickness gauge and slot, surface profiling systems, optical flats and vacuum hold-down are described and their applications reviewed.
引用
收藏
页码:35 / 36
相关论文
empty
未找到相关数据