THICK-FILM PROCESSING CONSIDERATIONS.

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作者：

Vitriol, William

Counts, William

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Electronic Packaging and Production | 1975年 / 15卷 / 09期

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摘要：

An acceptable thick-film conductor must exhibit strong substrate adherence, solderability and leach resistance, high conductivity, the ability to withstand multiple firings and must have a reasonable cost. The authors describe the specific requirements for each of these factors. Conductors must also be evaluated on their performance when interfacing with resistors. Certain reactions occur in the overlap area, depending upon which of the two films is fired first or whether they are cofired. Interfacing conductors with dielectric and crossover materials can compound the problem because of the double metallization layer. Silver or silver/palladium systems are so reactive they cannot be used for multilayer construction.

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页码：37 / 38