共 50 条
- [32] Auger electron spectroscopy study on the stability and the interfacial reaction of Ta, Ta-N and TaN films as a diffusion barrier between Cu9Al4 film and Si Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers, 1993, 32 (02): : 911 - 915
- [33] AUGER-ELECTRON SPECTROSCOPY STUDY ON THE STABILITY AND THE INTERFACIAL REACTION OF TA, TA-N AND TAN FILMS AS A DIFFUSION BARRIER BETWEEN CU9AL4 FILM AND SI JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1993, 32 (02): : 911 - 915
- [36] Intermetallic compound and martensitic transformation in Ag/Cu co-modified Ti6Al4V alloy JOURNAL OF MATERIALS RESEARCH AND TECHNOLOGY-JMR&T, 2023, 24 : 8940 - 8954
- [37] Preparation of Cu2ZnSnSe4 thin films by selenization of precursor evaporated from Cu2ZnSnSe4 compound PHYSICA STATUS SOLIDI C: CURRENT TOPICS IN SOLID STATE PHYSICS, VOL 10, NO 7-8, 2013, 10 (7-8): : 1071 - 1074
- [39] PREPARATION AND X-RAY-INVESTIGATION OF A NEW COMPOUND CU2AL4O7 MONATSHEFTE FUR CHEMIE, 1981, 112 (01): : 51 - 57
- [40] Preparation of nanocrystalline Al3Ti/Al13(Fe,Ni)4intermetallic compound by means of melt spinning and subsequent annealing 1600, Elsevier Ltd (688):