Lead-free processing: thermal effect on components

被引：0

作者：

Tenya, Yuichi ^{[1
]}

Adams, Tom ^{[1
]}

机构：

[1] Toshiba Chemical Corp, Tokyo, Japan

来源：

Surface mount technology | 2000年 / 14卷 / 11期

关键词：

Acoustic imaging - Delamination - Soldering alloys - Thermal effects;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Exposure to the higher temperatures needed for lead-free processing may shock surface mount devices (SMD) because most designs and encapsulating materials are geared for the lower temperatures of Sn/Pb. Although numerous lead-free alloys have been proposed as replacements for conventional Sn/Pb, the feasible replacements mostly are Sn/Ag/Cu alloys.

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