Determination of the planarization distance for copper CMP process

被引：0
|
作者：
Hymes, S. [1 ]
Smekalin, K. [1 ]
Brown, T. [1 ]
Yeung, H. [1 ]
Joffe, M. [1 ]
Banet, M. [1 ]
Park, T. [1 ]
Tugbawa, T. [1 ]
Boning, D. [1 ]
Nguyen, J. [1 ]
West, T. [1 ]
Sands, W. [1 ]
机构：
[1] SEMATECH, Austin, United States
来源：
Materials Research Society Symposium - Proceedings | 2000年 / 566卷
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摘要：
5
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页码：211 / 216
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