Diffusion bonding mechanism of submicron composite Al2O3p/6061Al

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作者：
Niu, Jitai
Liu, Liming
Wu, Gaohui
Zhai, Jinfan
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Zhongguo Youse Jinshu Xuebao/Chinese Journal of Nonferrous Metals | / 9卷 / 03期
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页码：477 / 481
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