Recent advances in flip chip wafer bumping using solder paste technology

被引：0
|
作者：
Elenius, Peter [1 ]
Leal, Jim [1 ]
Ney, Joe [1 ]
Stepniak, Dave [1 ]
Yeh, Shing [1 ]
机构：
[1] Flip Chip Technologies, Phoenix, United States
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：260 / 265
相关论文
共 50 条
  • [21] Sapphire wafer bumping by lead-free solder paste printing process
    Yang, Zhiyuan
    2007 9TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, VOLS 1 AND 2, 2007, : 902 - 905
  • [22] Fluxless flip-chip bonding using a lead-free solder bumping technique
    Hansen, K.
    Kousar, S.
    Pitzl, D.
    Arab, S.
    JOURNAL OF INSTRUMENTATION, 2017, 12
  • [23] Optimization of stencil printing wafer bumping for fine pitch flip chip applications
    Gong, JF
    Yau, EWC
    Chan, PCH
    Lee, RSW
    Yuen, MMF
    53RD ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2003 PROCEEDINGS, 2003, : 1724 - 1730
  • [24] Flip chip solder bumping compatibility on Cu/low-k devices
    Ling, J
    Rasco, M
    Elenius, P
    Augur, R
    Strothmann, T
    ADVANCED METALLIZATION CONFERENCE 2003 (AMC 2003), 2004, : 179 - 183
  • [25] Stencil printing technology for 100μm flip chip bumping
    Manessis, D
    Patzelt, R
    Ostmann, A
    Aschenbrenner, R
    Reichl, H
    2003 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2003, 5288 : 241 - 246
  • [26] Process development of electroplate bumping for ULSI flip chip technology
    Kiumi, R
    Yoshioka, J
    Kuriyama, F
    Saito, N
    Shimoyama, M
    52ND ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2002 PROCEEDINGS, 2002, : 711 - 716
  • [27] Bump formation for flip chip and CSP by solder paste printing
    Kloeser, J
    Coskina, P
    Aschenbrenner, R
    Reichl, H
    MICROELECTRONICS RELIABILITY, 2002, 42 (03) : 391 - 398
  • [28] Solder wetting in a wafer-level flip chip assembly
    Lu, J
    Busch, SC
    Baldwin, DF
    51ST ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, 2001, : 372 - 377
  • [29] Solder wetting in a wafer-level flip chip assembly
    Lu, JC
    Busch, SC
    Baldwin, DF
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2001, 24 (03): : 154 - 159
  • [30] Injection molded solder technology for Pb-free wafer bumping
    Gruber, PA
    Shih, DY
    Belanger, L
    Brouillette, G
    Danovitch, D
    Oberson, V
    Turgeon, M
    Kimura, H
    54TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, VOLS 1 AND 2, PROCEEDINGS, 2004, : 650 - 654
12345