Recent advances in flip chip wafer bumping using solder paste technology

被引：0
|
作者：
Elenius, Peter [1 ]
Leal, Jim [1 ]
Ney, Joe [1 ]
Stepniak, Dave [1 ]
Yeh, Shing [1 ]
机构：
[1] Flip Chip Technologies, Phoenix, United States
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
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页码：260 / 265
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