CLOSELY PACKED MICROSTRIP LINES AS VERY HIGH SPEED CHIP-TO-CHIP INTERCONNECTS.

被引：0
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作者：
Kwon, Oh-Kyong [1 ]
Pease, R.Fabian W. [1 ]
机构：
[1] Stanford Univ, CA, USA, Stanford Univ, CA, USA
来源：
IEEE transactions on components, hybrids, and manufacturing technology | 1986年 / CHMT-10卷 / 03期
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摘要：
15
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页码：314 / 320
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