BUFFERING FOR HIGH-SPEED DATA TRANSFER.

被引：0
|
作者：
Wade, F.L.
机构：
来源：
IBM Technical Disclosure Bulletin | 1972年 / 15卷 / 05期
关键词：
D O I：
暂无
中图分类号：
TP [自动化技术、计算机技术];
学科分类号：
0812 ;
摘要：
引用
收藏
页码：1426 / 1429
相关论文
共 50 条
  • [1] DESIGNING FOR HIGH-SPEED TRANSFER.
    Jones, John Rees
    Engineering (London), 1984, 224 (08): : 628 - 629
  • [2] High-speed data transfer
    Research & Development (Barrington, Illinois), 2000, 42 (02):
  • [3] HIGH-SPEED DATA BUFFERING USING A NXM SAW RAM
    MANES, GF
    GERLI, D
    TORTOLI, P
    ATZENI, C
    IEEE TRANSACTIONS ON SONICS AND ULTRASONICS, 1982, 29 (03): : 166 - 167
  • [4] High-Speed Data Transfer Using PLC
    Misurec, Jiri
    Orgon, Milos
    2018 25TH INTERNATIONAL CONFERENCE ON SYSTEMS, SIGNALS AND IMAGE PROCESSING (IWSSIP), 2018,
  • [5] Receiving Buffer Adaptation for High-Speed Data Transfer
    Liu, Hao
    Zhang, Yaoxue
    Zhou, Yuezhi
    Fu, Xiaoming
    Yang, Laurence T.
    IEEE TRANSACTIONS ON COMPUTERS, 2013, 62 (11) : 2278 - 2291
  • [6] A priority buffering queue architecture in high-speed switch
    Yang, YH
    Bin, WL
    Zheng, YQ
    DCABES 2001 PROCEEDINGS, 2001, : 188 - 191
  • [7] Time-averaging of high-speed data transfer protocols
    Marquez, R
    Altman, E
    Solé-Alvarez, S
    IEEE TRANSACTIONS ON AUTOMATIC CONTROL, 2005, 50 (12) : 2065 - 2069
  • [8] A technique for high-speed digital data transfer based on crosstalk
    Osaka, Hideki
    Uematsu, Yukata
    Sakisaka, Yasunori
    Ikeda, Hiroaki
    ELECTRONICS AND COMMUNICATIONS IN JAPAN PART II-ELECTRONICS, 2006, 89 (12): : 43 - 52
  • [9] A High-speed Wireless Data Transfer for Non Destructive Testing
    Dangba, Hanh
    Bui-ngoc, Thang
    Kim, Hae-jin
    Song, Jun-hee
    Chung, Chaiyoon
    Byun, Gyung-Su
    18TH INTERNATIONAL SOC DESIGN CONFERENCE 2021 (ISOCC 2021), 2021, : 315 - 316
  • [10] High-speed data transfer with FPGAs and QSFP plus modules
    Ammendola, R.
    Biagioni, A.
    Chiodi, G.
    Frezza, O.
    Lo Cicero, F.
    Lonardo, A.
    Lunadei, R.
    Paolucci, P. S.
    Rossetti, D.
    Salamon, A.
    Salina, G.
    Simula, F.
    Tosoratto, L.
    Vicini, P.
    JOURNAL OF INSTRUMENTATION, 2010, 5
12345