Sub-surface analyses of defects in integrated devices by scanning probe acoustic microscopy

被引：0
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作者：
Cramer, R.M. [1 ]
Biletzki, V. [1 ]
Lepidis, P. [1 ]
Balk, L.J. [1 ]
机构：
[1] Lehrstuhl für Elektronik, Bergische Universität Wuppertal, 42097 Wuppertal, Germany
来源：
Microelectronics Reliability | / 39卷 / 6-7期
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页码：947 / 950
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