共 50 条
- [1] ADVANCES IN ELECTROLYTIC COPPER PLATING OF PRINTED CIRCUIT BOARDS. Electri-onics, 1986, 32 (03): : 29 - 32
- [3] Plasma Desmearing of Multilayer Printed Circuit Boards. MO Metalloberflache Beschichten von Metall und Kunststoff, 1987, 41 (11): : 521 - 525
- [4] ELECTROLESS COPPER PLATING OF MULTILAYER PRINTED-CIRCUIT BOARDS PLATING AND SURFACE FINISHING, 1978, 65 (07): : 36 - 41
- [6] Surface preparation before chemical copper plating of holes in printed circuit boards. Part I INTERNATIONAL JOURNAL OF CORROSION AND SCALE INHIBITION, 2022, 11 (04): : 1593 - 1603
- [7] Developing a decoupling methodology with SPICE for multilayer printed circuit boards. 1998 IEEE INTERNATIONAL SYMPOSIUM ON ELECTROMAGNETIC COMPATIBILITY - SYMPOSIUM RECORD, VOLS 1 AND 2, 1998, : 652 - 655
- [8] BETTER UNDERSTANDING OF THE THROUGH-HOLE PLATING OF PRINTED CIRCUIT BOARDS. Transactions of the Institute of Metal Finishing, 1982, 60 (pt 4): : 131 - 136
- [9] ROUTING OF PRINTED CIRCUIT BOARDS. Proceedings - Design Automation Conference, 1981, : 130 - 136