Twisted differential transmission line structure for global interconnect in Si LSI

被引：0
作者：
Ito, Hiroyuki [1 ]
Gomi, Shinichiro [1 ]
Sugita, Hideyuki [1 ]
Okada, Kenichi [1 ]
Masu, Kazuya [1 ]
机构：
[1] Precision and Intelligence Laboratory, Tokyo Institute of Technology, 4259-R2-17 Nagatsuta, Midori-ku, Yokohama 226-8503, Japan
来源：
Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 2005年 / 44卷 / 4 B期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
12
引用
收藏
页码：2774 / 2779
相关论文
共 50 条
  • [11] Pseudo differential transmission line structure on SiULSI
    Sugita, H
    Ito, H
    Gomi, S
    Okada, K
    Masu, K
    ADVANCED METALLIZATION CONFERENCE 2004 (AMC 2004), 2004, : 165 - 170
  • [12] On-chip Differential-Transmission-Line(DTL) interconnect for 22nm technology
    Okada, Kenichi
    Ito, Hiroyuki
    Masu, Kazuya
    ADVANCED METALLIZATION CONFERENCE 2006 (AMC 2006), 2007, : 29 - 33
  • [13] A low-power differential transmission line interconnect using wafer level package technology
    Maekawa, Tomoaki
    Ishii, Takahiro
    Seita, Junki
    Ito, Hiroyuki
    Okada, Kenichi
    Hatakeyama, Hideki
    Uemichi, Yusuke
    Aizawa, Takuya
    Ito, Tatsuya
    Yamauchi, Ryozo
    Masu, Kazuya
    2008 IEEE WORKSHOP ON SIGNAL PROPAGATION ON INTERCONNECTS, 2008, : 99 - +
  • [14] A novel twisted differential line on PCB: Crosstalk model and its application to high-speed interconnect circuit design
    Kam, DG
    Kim, JG
    ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 2002, : 153 - 156
  • [15] Optimization methodology of global interconnect structure
    Inoue, J
    Nakashima, H
    Kyogoku, T
    Uezono, T
    Okada, K
    Masu, K
    16TH INTERNATIONAL CONFERENCE ON MICROELECTRONICS, PROCEEDINGS, 2004, : 351 - 354
  • [16] TWISTED MAGNET WIRE TRANSMISSION-LINE
    LEFFERSON, P
    IEEE TRANSACTIONS ON PARTS HYBRIDS AND PACKAGING, 1971, PHP7 (04): : 148 - +
  • [17] Reduction of Transmission Line Losses Using VLSI Interconnect
    Abbasi, Ruby
    INTERNATIONAL CONFERENCE ON COMMUNICATION TECHNOLOGY AND SYSTEM DESIGN 2011, 2012, 30 : 10 - 19
  • [18] Design Methodology of High Performance On-Chip Global Interconnect Using Terminated Transmission-Line
    Zhang, Yulei
    Zhang, Ling
    Deutsch, Alina
    Katopis, George A.
    Dreps, Daniel M.
    Buckwalter, James F.
    Kuh, Ernest S.
    Cheng, Chung-Kuan
    ISQED 2009: PROCEEDINGS 10TH INTERNATIONAL SYMPOSIUM ON QUALITY ELECTRONIC DESIGN, VOLS 1 AND 2, 2009, : 451 - +
  • [19] High speed and low power globel interconnect IP with differential transmission line and driver-receiver circuits
    Gomi, S
    Nakamura, K
    Ito, H
    Okada, K
    Masu, K
    PROCEEDINGS OF 2004 IEEE ASIA-PACIFIC CONFERENCE ON ADVANCED SYSTEM INTEGRATED CIRCUITS, 2004, : 384 - 387
  • [20] Transmission line Model for inherently stable MSWCNT bundled global interconnect for 22nm Technology Node
    Mishra, Shailendra
    Mishra, Divya
    2017 4TH IEEE UTTAR PRADESH SECTION INTERNATIONAL CONFERENCE ON ELECTRICAL, COMPUTER AND ELECTRONICS (UPCON), 2017, : 184 - 190
12345