Development of GaAs LSI packaging technology

被引:0
作者
Moriyama, Yutaka
Goto, Noboru
Fujihira, Mitsuaki
Miki, Atsushi
Nishiguchi, Masanori
Nishizawa, Hideaki
机构
来源
Sumitomo Electric Technical Review | 1992年 / 34期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
相关论文
共 50 条
  • [21] BROKEN PROMISE OF LSI - PACKAGING
    BRINTON, J
    [J]. ELECTRONICS, 1970, 43 (07): : 123 - &
  • [22] Embedded Active Packaging Technology for High-Pin-Count LSI With Cu Plate
    Mori, Kentaro
    Ohshima, Daisuke
    Sasaki, Hideki
    Fujimura, Yuki
    Kikuchi, Katsumi
    Nakashima, Yoshiki
    Enomoto, Mitsuru
    Miki, Ryu
    Hashiguchi, Takeya
    Funaya, Takuo
    Nishiyama, Tomohiro
    Yamamichi, Shintaro
    [J]. IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (01): : 60 - 68
  • [23] GAAS LSI GOES COMMERCIAL
    COLE, BC
    [J]. ELECTRONICS, 1986, 59 (31): : 57 - 60
  • [24] LATEST ADVANCES IN MOS/LSI PACKAGING
    NIXEN, D
    [J]. AMERICAN CERAMIC SOCIETY BULLETIN, 1971, 50 (09): : 805 - &
  • [25] LSI PACKAGING THAT PASSES PIND TEST
    DALPORTO, JF
    LOESCHER, DH
    OLSON, HC
    PLUNKETT, PV
    [J]. IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1981, 4 (04): : 471 - 475
  • [26] Development of Controlled Release Packaging Technology
    Yam, Kit. L.
    Zhu, Xuntao
    [J]. FOOD ADDITIVES AND PACKAGING, 2014, 1162 : 127 - +
  • [27] ADVANCES IN DIGITAL TECHNOLOGY HASTEN FULL-SYSTEM CHIPS AND GAAS LSI CIRCUITS
    BURSKY, D
    [J]. ELECTRONIC DESIGN, 1983, 31 (12) : 101 - &
  • [28] GAAS METAL-SEMICONDUCTOR TECHNOLOGY PROMISES GIGAHERTZ LSI AT LOW-POWER
    DAVIS, S
    [J]. EDN MAGAZINE-ELECTRICAL DESIGN NEWS, 1978, 23 (17): : 44 - &
  • [29] Development Trends in Unipolar Technology for LSI Integrated Circuits.
    Georgijew, W.
    [J]. Elektronika, 1979, 20 (02): : 57 - 59
  • [30] SOS LSI TECHNOLOGY
    TANGO, H
    MAEGUCHI, K
    SUGINO, E
    [J]. TOSHIBA REVIEW, 1978, (113): : 34 - 37