Development of GaAs LSI packaging technology

被引：0

作者：

Moriyama, Yutaka

Goto, Noboru

Fujihira, Mitsuaki

Miki, Atsushi

Nishiguchi, Masanori

Nishizawa, Hideaki

机构：

来源：

Sumitomo Electric Technical Review | 1992年 / 34期

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[1] LSI PACKAGING TECHNOLOGY FOR MAINFRAME COMPUTERS
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[3] GAAS LSI NEARS AS PROCESSING TECHNOLOGY MATURES
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[4] PLANAR GAAS IC TECHNOLOGY - APPLICATIONS FOR DIGITAL LSI
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[5] ADVANCES IN GAAS LSI-VLSI PROCESSING TECHNOLOGY
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[6] Development of the embedded LSI technology in PALAP™
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[8] HALF-MICRON-GATE GAAS LSI FABRICATION TECHNOLOGY
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[10] PACKAGING TECHNOLOGY FOR HEMT LSI DEVICES OPERATED IN LIQUID-NITROGEN
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