PACKAGING A HIGH-DENSITY HYBRID MULTIPLEXER.

被引：0

作者：

Polin, Dan

Williamson, Manford

机构：

来源：

Electronic Packaging and Production | 1974年 / 14卷 / 11期

关键词：

INTEGRATED CIRCUITS; HYBRID;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

It is reported that in order to meet the stringent space requirements for an Airborne Warning And Control System (AWACS) program, high-density packaging techniques were needed in designing a multiplexer module. The problem was solved by using two multilayer substrates mounted in piggyback fashion within a metal hybrid package. One substrate contained all thick-film resistors, and the other accommodated the chip capacitors and IC's. The circuit volume was further reduced by mounting the package to the connector by using flat cable.

引用

页码：79 / 81

共 50 条

[1] CUSTOMIZED MULTIPLEXER.
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IBM technical disclosure bulletin, 1983, 25 (11 A): : 5665 - 5666
[2] CONTIGUOUS BAND MULTIPLEXER.
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1600, IEEE (77CH1257-5 Reg 8), New York, NY
[3] HIGH-DENSITY HYBRID MODULE - CHIP AND WIRE TECHNOLOGY IS THE BEST FLEXIBLE APPROACH TO HIGH-DENSITY PACKAGING
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[4] KEELE TERMINAL MULTIPLEXER.
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[5] CONTIGUOUS BAND MULTIPLEXER.
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1600, (06):
[6] HIGH-DENSITY PACKAGING TECHNOLOGY
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[7] HIGH-DENSITY PACKAGING - INTRODUCTION
不详
ELECTRONIC DESIGN, 1987, 35 (06) : 15 - 15
[8] PROGRAMMABLE DIGITAL INPUT MULTIPLEXER.
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[9] PACKAGING DESIGN, MATERIALS AND PROCESSES - HIGH-DENSITY PACKAGING
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[10] PLASTICS IN PACKAGING - HIGH-DENSITY POLYETHYLENE
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CAMP, JR
PLASTICS ENGINEERING, 1978, 34 (10) : 37 - 38

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