共 50 条
- [31] A flip-chip LIGA assembly technique via electroplating MICROSYSTEM TECHNOLOGIES-MICRO-AND NANOSYSTEMS-INFORMATION STORAGE AND PROCESSING SYSTEMS, 2001, 7 (01): : 40 - 43
- [32] COPLANAR FLIP-CHIP MOUNTING TECHNIQUE FOR PICOSECOND DEVICES REVIEW OF SCIENTIFIC INSTRUMENTS, 1984, 55 (11): : 1854 - 1858
- [33] HYDROGEN PLASMAS FOR FLUX FREE FLIP-CHIP SOLDER BONDING JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A-VACUUM SURFACES AND FILMS, 1990, 8 (03): : 1503 - 1508
- [34] Building blocks of a flip-chip integrated superconducting quantum processor QUANTUM SCIENCE AND TECHNOLOGY, 2022, 7 (03):
- [35] Circuit modeling of isolation in flip-chip microwave integrated circuits ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 217 - 220
- [38] Investigation of chip-on-flex application using SBB flip-chip technique 1999 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, PROCEEDINGS, 1999, 3906 : 137 - 142
- [39] A new flip-chip mounting technique for high temperature operation ELECTRICAL PERFORMANCE OF ELECTRONIC PACKAGING, 1997, : 95 - 98
- [40] Effects of no-clean flux residue on the performance of flip-chip devices INTERNATIONAL SYMPOSIUM ON ADVANCED PACKAGING MATERIALS: PROCESSES, PROPERTIES AND INTERFACES, PROCEEDINGS, 2000, : 180 - 182