Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications

被引：0

作者：

Yim, Myung-Jin ^{[1
]}

Ryu, Woonghwan ^{[1
]}

Jeon, Young-Doo ^{[1
]}

Lee, Junho ^{[1
]}

Kim, Joungho ^{[1
]}

Paik, Kyung-Wook ^{[1
]}

机构：

[1] KAIST, Taejon, Korea, Republic of

来源：

Proceedings - Electronic Components and Technology Conference | 1999年

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：488 / 492

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