Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications

被引：0
作者：
Yim, Myung-Jin [1 ]
Ryu, Woonghwan [1 ]
Jeon, Young-Doo [1 ]
Lee, Junho [1 ]
Kim, Joungho [1 ]
Paik, Kyung-Wook [1 ]
机构：
[1] KAIST, Taejon, Korea, Republic of
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：488 / 492
相关论文
共 50 条
  • [21] Effects of solder reflow on the reliability of flip-chip on flex interconnections using anisotropic conductive adhesives
    Yin, CY
    Lu, H
    Bailey, C
    Chan, YC
    IEEE TRANSACTIONS ON ELECTRONICS PACKAGING MANUFACTURING, 2004, 27 (04): : 254 - 259
  • [22] Lifetime model for flip-chip on flex using anisotropic conductive adhesive under moisture and temperature loading
    Wunderle, B.
    Kallmayer, C.
    Walter, H.
    Braun, T.
    Michel, B.
    Reichl, H.
    2008 11TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS, VOLS 1-3, 2008, : 799 - +
  • [23] CONTACT RESISTANCE OF ANISOTROPIC CONDUCTIVE ADHESIVE FILM BASED FLIP-CHIP ON GLASS PACKAGES
    Uddin, M. A.
    Chan, H. P.
    REVIEWS ON ADVANCED MATERIALS SCIENCE, 2011, 27 (02) : 151 - 157
  • [24] Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film
    Uddin, MA
    Alam, MO
    Chan, YC
    Chan, HP
    JOURNAL OF ELECTRONIC MATERIALS, 2003, 32 (10) : 1117 - 1124
  • [25] Plasma cleaning of the flex substrate for flip-chip bonding with anisotropic conductive adhesive film
    M. A. Uddin
    M. O. Alam
    Y. C. Chan
    H. P. Chan
    Journal of Electronic Materials, 2003, 32 : 1117 - 1124
  • [26] Wafer level packages (WLPs) using anisotropic conductive adhesives (ACAs) solution for flip-chip interconnections
    Kim, Il
    Jang, Kyung-Woon
    Son, Ho-Young
    Kim, Jae-Han
    Paik, Kyung-Wook
    58TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE, PROCEEDINGS, 2008, : 219 - +
  • [27] Wafer-Level Packages Using Anisotropic Conductive Adhesives (ACAs) Solution for Flip-Chip Interconnections
    Kim, Il
    Jang, Kyung-Woon
    Son, Ho-Young
    Kim, Jae-Han
    Paik, Kyung-Wook
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2011, 1 (05): : 792 - 797
  • [28] The Application of Anisotropic Conductive Adhesive in Broadband Microwave Interconnections
    Zhao, Mingxiao
    Wang, Hui
    Dong, Le
    2018 INTERNATIONAL CONFERENCE ON MICROWAVE AND MILLIMETER WAVE TECHNOLOGY (ICMMT2018), 2018,
  • [29] Microwave preheating of anisotropic conductive adhesive films for high-speed flip chip on flex bonding
    Islam, RA
    Chan, YC
    JOURNAL OF ELECTRONIC MATERIALS, 2006, 35 (01) : 123 - 131
  • [30] New adhesives for high density flip-chip interconnections
    Wojciechowski, D
    Vanfleteren, J
    Reese, E
    Hagedorn, HW
    1998 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 1998, 3582 : 224 - 229
12345