Microwave model of anisotropic conductive adhesive flip-chip interconnections for high frequency applications

被引：0
|
作者：
Yim, Myung-Jin [1 ]
Ryu, Woonghwan [1 ]
Jeon, Young-Doo [1 ]
Lee, Junho [1 ]
Kim, Joungho [1 ]
Paik, Kyung-Wook [1 ]
机构：
[1] KAIST, Taejon, Korea, Republic of
来源：
Proceedings - Electronic Components and Technology Conference | 1999年
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页码：488 / 492
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