共 50 条
- [1] IMPROVEMENTS IN STRESS CONTROL MATERIALS. Proceedings of the Technical Programme - INTERNEPCON: International Electronic Packaging and Production Conferences, 1979, : 264 - 270
- [2] New Impact Molding Method for the Compaction of Clay-bounded Molding Materials. Giesserei, 1981, 68 (20): : 603 - 610
- [3] Possibilities of Water Supply Automation in Conditioning of Clay-Bonded Mold Materials. Giessereitechnik, 1979, 25 (02): : 48 - 53
- [4] Testing and Evaluation of the High-temperature Properties of Clay-bonded Molding Materials. Giessereitechnik, 1980, 26 (12): : 383 - 390