TAKING THE HEAT OFF.

被引：0

作者：

Buckley, David ^{[1
]}

机构：

[1] ENCO Industries Ltd, Scott, ENCO Industries Ltd, Scott

来源：

EP Electronic Production (London) | 1987年 / 16卷 / 11期

关键词：

COMPUTER AIDED ANALYSIS - HEAT SINKS - Applications - THERMOANALYSIS;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

Because of the lack of space in tightly-packed sealed electronic assemblies used in military/aerospace equipment, the removal of unwanted heat is achieved by means of conduction cooling. Appropriately designed heat sinks, or thermal planes, transfer the heat to the 'cold wall'. But too many designers leave heat dissipation considerations until the last minute. Enco's computer-aided thermal analysis system is used to establish the thermal problems associated with each printed circuit board (PCB) assembly. Factors taken into account by the analysis include heat generated on the board, heat transferred from other boards, thermal characteristics of the enclosure system, and any convection or radiation cooling that may be available.

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