Solder alloy selection for flip chip on board

被引：0
|
作者：
Rinne, Glenn A. [1 ]
Magill, Paul A. [1 ]
Machon, Wayne C. [1 ]
Mis, J.Daniel [1 ]
Baggs, Joseph W. [1 ]
机构：
[1] Unitive Electronics Inc, Research Triangle Park, United States
来源：
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 1998年
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
19
引用
收藏
页码：118 / 122
相关论文
共 50 条
  • [31] Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
    Lau, JH
    Lee, SWR
    Chang, C
    Ouyang, C
    49TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 1999 PROCEEDINGS, 1999, : 571 - 582
  • [32] Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
    Lau, John H.
    Lee, S.-W.Ricky
    Chang, Chris
    Ouyang, Chien
    Proceedings - Electronic Components and Technology Conference, 1999, : 571 - 582
  • [33] Study on Board Level Solder Joints Reliability Analysis of the Copper Stud Bump Flip-Chip
    Mu Wei
    Zhou Dejian
    Wu Zhaohua
    2010 11TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY & HIGH DENSITY PACKAGING (ICEPT-HDP), 2010, : 1018 - 1022
  • [34] Effects of underfill material properties on the reliability of solder bumped flip chip on board with imperfect underfill encapsulants
    Lau, JH
    Lee, SWR
    Chang, C
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2000, 23 (02): : 323 - 333
  • [35] Flip chip reliability modeling based on solder fatigue as applied to flip chip on laminate assemblies
    Popelar, S
    Roesch, M
    2000 INTERNATIONAL SYMPOSIUM ON MICROELECTRONICS, 2000, 4339 : 477 - 483
  • [36] Thermal cycling lifetime of flip chip on board circuits with solder bumps and isotropically conductive adhesive joints
    Nysæther, JB
    Lai, ZH
    Liu, JH
    IEEE TRANSACTIONS ON ADVANCED PACKAGING, 2000, 23 (04): : 743 - 749
  • [37] Board level solder joint reliability analysis of stacked die mixed flip-chip and wirebond BGA
    Tee, Tong Yan
    Ng, Hun Shen
    Zhong, Zhaowei
    MICROELECTRONICS RELIABILITY, 2006, 46 (12) : 2131 - 2138
  • [38] A Review on Solder Reflow and Flux Application for Flip Chip
    Suppiah, Sarveshvaran
    Ong, Nestor Rubio
    Sauli, Zaliman
    Sarukunaselan, Karunavani
    Alcain, Jesselyn Barro
    Visvanathan, Susthitha Menon
    Retnasamy, Vithyacharan
    3RD ELECTRONIC AND GREEN MATERIALS INTERNATIONAL CONFERENCE 2017 (EGM 2017), 2017, 1885
  • [39] Design and Research of Oval Flip Chip Solder Bump
    Li, Guoshuai
    Zheng, Linghui
    Wang, Lina
    2023 24TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY, ICEPT, 2023,
  • [40] Deformation analysis on flip chip solder interconnects by microDAC
    Vogel, D
    Auersperg, J
    Schubert, A
    Michel, B
    Reichl, H
    DESIGN & RELIABILITY OF SOLDERS AND SOLDER INTERCONNECTIONS, 1997, : 429 - 438
12345