Solder alloy selection for flip chip on board

被引：0
|
作者：
Rinne, Glenn A. [1 ]
Magill, Paul A. [1 ]
Machon, Wayne C. [1 ]
Mis, J.Daniel [1 ]
Baggs, Joseph W. [1 ]
机构：
[1] Unitive Electronics Inc, Research Triangle Park, United States
来源：
Proceedings of the International Symposium and Exhibition on Advanced Packaging Materials Processes, Properties and Interfaces | 1998年
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D O I：
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学科分类号：
摘要：
19
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页码：118 / 122
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