Efficient extraction method for frequency-dependent parameters of on-chip interconnects in high-speed ICs

An efficient two-dimensional finite difference time domain method was used for the accurate computation of frequency-dependent parameters of on-chip interconnects in high-speed ICs. A graded mesh algorithm and the lossy absorbing boundary condition were adopted to reduce the number of spatial grid points. The introduction of time series prediction method to predict the signal in time domain or extract the parameters of uniform transmission lines in frequency domain reduces computation time drastically. This algorithm can significantly reduce CPU time and storage requirements as compared with the conventional three-dimensional finite difference time. The losses of Si substrate and conductor are included in the analysis. The simulation results are in good agreement with the results obtained by other methods and measurement.