CONDUCTIVE EPOXY IS TESTED FOR SMT SOLDER REPLACEMENT.

被引：0
作者：
Pound, Ronald [1 ]
机构：
[1] Electronic Packaging &, Production, Des Plaines, IL, USA, Electronic Packaging & Production, Des Plaines, IL, USA
来源：
Electronic Packaging and Production | 1985年 / 25卷 / 02期
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摘要：
3
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页码：86 / 90
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