Integrated transient thermal and mechanical analysis of molded PBGA packages during thermal shock

被引：0
|
作者：
Mercado, Lei L. [1 ]
Lee, Tien-Yu Tom [1 ]
Cook, Jeff [1 ]
机构：
[1] Motorola, Inc, Tempe, United States
来源：
American Society of Mechanical Engineers, Design Engineering Division (Publication) DE | 1999年 / 104卷
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页码：111 / 119
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