Solder joint reliability of plastic ball grid array packages

被引：0
|
作者：
Zhong, Chong Hua [1 ]
Yi, Sung [1 ]
机构：
[1] Advanced Micro Devices (Singapore), Pte Ltd, Singapore, Singapore
来源：
Soldering and Surface Mount Technology | 1999年 / 11卷 / 01期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
10
引用
收藏
页码：44 / 48
相关论文
共 50 条
  • [1] Solder joint reliability of plastic ball grid array packages
    Zhong, CH
    Yi, S
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1999, 11 (01) : 44 - 48
  • [2] Effect of chip dimension and substrate thickness on the solder joint reliability of plastic ball grid array packages
    Hong Kong Univ of Science and, Technology, Hong Kong
    Circuit World, 1 (16-19):
  • [3] Plastic ball grid array solder joint reliability for avionics applications
    Qi, Haiyu
    Osterman, Michael
    Pecht, Michael
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2007, 30 (02): : 242 - 247
  • [4] Solder joint reliability of plastic ball grid array with solder bumped flip chip
    Lee, SWP
    Lau, JH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2000, 12 (02) : 16 - 23
  • [5] Solder ball failure mechanisms in plastic ball grid array packages
    Zhong, CH
    Yi, S
    Whalley, DC
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 2002, 14 (02) : 40 - 50
  • [6] Missing solder ball failure mechanisms in plastic ball grid array packages
    Zhong, CH
    Yi, S
    Mui, YC
    Howe, CP
    Olsen, D
    Chen, WT
    50TH ELECTRONIC COMPONENTS & TECHNOLOGY CONFERENCE - 2000 PROCEEDINGS, 2000, : 151 - 159
  • [7] Solder Ball Attachment Assessment of Reballed Plastic Ball Grid Array Packages
    Nie, Lei
    Osterman, Michael
    Song, Fubin
    Lo, Jeffery
    Lee, S. W. Ricky
    Pecht, Michael
    IEEE TRANSACTIONS ON COMPONENTS AND PACKAGING TECHNOLOGIES, 2009, 32 (04): : 901 - 908
  • [8] Study on the solder joint reliability of Plastic Ball Grid Array package for high reliability application
    Lin, Pengrong
    Lv, Xiaorui
    Ding, Yajun
    2017 18TH INTERNATIONAL CONFERENCE ON ELECTRONIC PACKAGING TECHNOLOGY (ICEPT), 2017, : 1429 - 1433
  • [9] Solder joint reliability of cavity-down plastic ball grid array assemblies
    Lee, SWR
    Lau, JH
    SOLDERING & SURFACE MOUNT TECHNOLOGY, 1998, 10 (01) : 26 - +
  • [10] Enhancing solder joint fatigue life for ball grid array packages
    Wei, Z
    Kuan, LB
    PROCEEDINGS OF 5TH ELECTRONICS PACKAGING TECHNOLOGY CONFERENCE, 2003, : 701 - 706
12345