SPUTTERING AND INTERCONNECT TRENDS.

被引：0

作者：

Burggraaf, Pieter ^{[1
]}

机构：

[1] Semiconductor Int, Denver, CO, USA, Semiconductor Int, Denver, CO, USA

来源：

Semiconductor International | 1984年 / 7卷 / 11期

关键词：

ALUMINUM AND ALLOYS - Sputtering - FILMS - Metallic - INTEGRATED CIRCUIT MANUFACTURE;

D O I：

暂无

中图分类号：

学科分类号：

摘要：

This article examines the current trends in sputtering technology as related to integrated circuit interconnections and production issues. Sputtering is considered to be the best technique for conventional metal deposition. The article claims that good step coverage over fine lines and difficult geometries is possible with careful control of the sputtering conditions. The article also claims that sputtering can also provide control of film thickness uniformity.

引用

页码：70 / 73