High temperature superconducting multilayer multichip module: fabrication and high speed characterization

被引：0
|
作者：
Anderson, Paul M. [1 ]
Lindner, Alan W. [1 ]
Chau, Paul M. [1 ]
Smith, Andrew D. [1 ]
机构：
[1] StratEdge Corp, San Diego, United States
来源：
IEEE Transactions on Applied Superconductivity | 1999年 / 9卷 / 2 III期
关键词：
Number:; 61331-96-C-0017; Acronym:; -; Sponsor:;
D O I：
暂无
中图分类号：
学科分类号：
摘要：
引用
收藏
页码：4099 / 4102
相关论文
共 50 条
  • [11] Multichip module integration technology for high-speed analog and digital applications
    Mangold, T.
    Wolf, J.
    Toepper, M.
    Reichl, H.
    Russer, P.
    Conference Proceedings of the International Symposium on Signals, Systems and Electronics, 1998, : 91 - 96
  • [12] A multichip module integration technology for high-speed analog and digital applications
    Mangold, T
    Wolf, J
    Töpper, M
    Reichl, H
    Russer, P
    1998 URSI SYMPOSIUM ON SIGNALS, SYSTEMS, AND ELECTR ONICS, 1998, : 91 - 96
  • [13] THE FABRICATION AND CHARACTERIZATION OF HIGH-TEMPERATURE SUPERCONDUCTING MAGNETIC-SHIELDS
    PURPURA, JW
    CLEM, TR
    IEEE TRANSACTIONS ON MAGNETICS, 1989, 25 (02) : 2506 - 2510
  • [14] Temperature Estimation of High Temperature Data Acquisition Multichip Module for Oil Field Apparatus
    Meng, Xianglong
    Wang, Guangwei
    Cao, Hui
    Gao, Shuang
    Cheng, Jingjng
    2016 15TH IEEE INTERSOCIETY CONFERENCE ON THERMAL AND THERMOMECHANICAL PHENOMENA IN ELECTRONIC SYSTEMS (ITHERM), 2016, : 218 - 222
  • [15] Design and fabrication of a high temperature (250°C baseplate), high power density silicon carbide (SiC) multichip power module (MCPM) inverter
    Cilio, Edgar
    Hornberger, Jared
    McPherson, Brice
    Schupbach, Roberto
    Lostetter, Alexander
    IECON 2006 - 32ND ANNUAL CONFERENCE ON IEEE INDUSTRIAL ELECTRONICS, VOLS 1-11, 2006, : 4397 - +
  • [16] Scaling studies of High Speed High Temperature Superconducting Generator
    Lokhandwalla, M.
    Haran, K. S.
    Alexander, J. P.
    2012 XXTH INTERNATIONAL CONFERENCE ON ELECTRICAL MACHINES (ICEM), 2012, : 751 - 756
  • [17] Packaging of High-Gain Multichip Module in Multilayer LCP Substrates at W-Band
    Zhang, Yifei
    Shi, Shouyuan
    Martin, Richard D.
    Wright, Andrew A.
    Yao, Peng
    Shreve, Kevin
    Harrity, Charles
    Prather, Dennis W.
    IEEE TRANSACTIONS ON COMPONENTS PACKAGING AND MANUFACTURING TECHNOLOGY, 2017, 7 (10): : 1655 - 1662
  • [18] 1. 8-GB-S HIGH-SPEED MULTICHIP SWITCHING MODULE USING COPPER-POLYIMIDE MULTILAYER SUBSTRATE
    YAMANAKA, N
    OHSAKI, T
    KIKUCHI, S
    KON, T
    SASAKI, S
    IEICE TRANSACTIONS ON COMMUNICATIONS ELECTRONICS INFORMATION AND SYSTEMS, 1991, 74 (08): : 2301 - 2308
  • [19] FABRICATION OF HIGH-DENSITY MULTICHIP MODULES
    RECHE, JJH
    SEVENTH IEEE/CHMT INTERNATIONAL ELECTRONIC MANUFACTURING TECHNOLOGY SYMPOSIUM: INTEGRATION OF THE MANUFACTURING FLOW - FROM RAW MATERIAL THROUGH SYSTEMS-LEVEL ASSEMBLY, 1989, : 104 - 109
  • [20] FABRICATION OF HIGH-DENSITY MULTICHIP MODULES
    RECHE, JJH
    IEEE TRANSACTIONS ON COMPONENTS HYBRIDS AND MANUFACTURING TECHNOLOGY, 1990, 13 (03): : 565 - 569
12345