Spectral Characterization of Amorphous Fluorinated Carbon Film with a Low Dielectric Constant

被引:0
|
作者
Ding, Shi-Jin
Wang, Peng-Fei
Zhang, Wei
Wang, Ji-Tao
Lee, Wei William
机构
[1] Department of Electronic Engineering, Fudan University, Shanghai 200433, China
[2] Taiwan Semiconduct. Mfg. Co., Hsinchu, Taiwan
来源
| 2001年 / Science Press卷 / 21期
关键词
D O I
暂无
中图分类号
学科分类号
摘要
Amorphous fluorinated carbon films have been prepared from the gaseous mixture of CH4 and C4F8 by plasma enhanced chemical vapor deposition (PECVD) method. The dielectric constant of the deposited film under the experimental conditions is 2.3. Fourier transform infrared spectrum (FTIR) indicates that the film contains minor unsaturated double bonds such as C=O, C=C , etc in addition to CFn (n = 1-3) configurations. However, no sign reveals the existence of C-H and O-H in the film. Further, X-ray photoelectron spectrum (XPS) verifies that carbon in the deposited film has six chemical states, which are CF3 (8%), CF2 (19%), CF (26.7%), C-CFn (42.5%), C-C(3.3%) and C=O (0.5%). It indicates that about 54% of carbon atoms in the film bond with fluorine atoms, and around 43% bond with carbon atoms of CFn configurations instead of bonding directly with fluorine atoms. The adjacent carbon atoms without bonding with fluorine are very less.
引用
收藏
相关论文
共 50 条
  • [21] Spectroscopic studies of low dielectric constant fluorinated amorphous carbon films for ulsi integrated circuits
    Ma, YJ
    Yang, HN
    Guo, J
    Sathe, C
    Agui, A
    Nordgren, J
    APPLICATIONS OF SYNCHROTRON RADIATION TECHNIQUES TO MATERIALS SCIENCE IV, 1998, 524 : 169 - 178
  • [22] Controlling fluorine concentration of fluorinated amorphous carbon thin films for low dielectric constant interlayer dielectrics
    Endo, K
    Tatsumi, T
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 2-LETTERS & EXPRESS LETTERS, 1997, 36 (11B): : L1531 - L1533
  • [23] Changes in structure and nature of defects by annealing of fluorinated amorphous carbon thin films with low dielectric constant
    Yokomichi, H
    Hayashi, T
    Masuda, A
    APPLIED PHYSICS LETTERS, 1998, 72 (21) : 2704 - 2706
  • [24] Controlling fluorine concentration of fluorinated amorphous carbon thin films for low dielectric constant interlayer dielectrics
    Endo, Kazuhiko
    Tatsumi, Toru
    Japanese Journal of Applied Physics, Part 2: Letters, 1997, 36 (11 B):
  • [25] Effect of CF4 plasma treatment on fluorinated amorphous carbon films with a low dielectric constant
    Ko, Ho Jeong
    Lee, Heon Ju
    Lee, Kwang-Man
    Choi, Chi Kyn
    JOURNAL OF CERAMIC PROCESSING RESEARCH, 2006, 7 (02): : 172 - 176
  • [26] Synthesis and characterization of fluorinated polybenzoxazine material with low dielectric constant
    Su, YC
    Chang, FC
    POLYMER, 2003, 44 (26) : 7989 - 7996
  • [27] A fluorinated organic-silica film with extremely low dielectric constant
    Uchida, Y
    Taguchi, K
    Sugahara, S
    Matsumura, M
    JAPANESE JOURNAL OF APPLIED PHYSICS PART 1-REGULAR PAPERS SHORT NOTES & REVIEW PAPERS, 1999, 38 (4B): : 2368 - 2372
  • [28] RC delay reduction of 0.18μm CMOS technology using low dielectric constant fluorinated amorphous carbon
    Matsubara, Y
    Kishimoto, K
    Endo, K
    Iguchi, M
    Tatsumi, T
    Gomi, H
    Horiuchi, T
    Tzou, E
    Xi, M
    Cheng, LY
    Tribula, D
    Moghadam, F
    INTERNATIONAL ELECTRON DEVICES MEETING 1998 - TECHNICAL DIGEST, 1998, : 841 - 844
  • [29] Integration of fluorinated amorphous carbon as low-dielectric constant insulator: Effects of heating and deposition of tantalum nitride
    Chang, JP
    Krautter, HW
    Zhu, W
    Opila, RL
    Pai, CS
    JOURNAL OF VACUUM SCIENCE & TECHNOLOGY A, 1999, 17 (05): : 2969 - 2974
  • [30] Effect of fluorine on the properties of low dielectric fluorinated amorphous carbon films
    Yang, SH
    Lee, S
    Park, J
    Sohn, S
    Park, JW
    Kim, JY
    JOURNAL OF THE KOREAN PHYSICAL SOCIETY, 1999, 35 : S361 - S364