Plating with tin and tin-lead alloys

被引：0

作者：

Fellman, Jack

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Printed Circuit Fabrication | 1992年 / 15卷 / 03期

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Printed Circuits;

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引用

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[21] ELECTRODEPOSITION KINETICS FOR TIN, LEAD, AND TIN-LEAD FLUOBORATE PLATING SOLUTIONS
TAM, TM
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, 1986, 133 (09) : 1792 - 1796
[22] ON THE PASSIVATION OF TIN-LEAD ALLOYS
GOBAL, F
INDIAN JOURNAL OF CHEMISTRY SECTION A-INORGANIC BIO-INORGANIC PHYSICAL THEORETICAL & ANALYTICAL CHEMISTRY, 1987, 26 (05): : 424 - 426
[23] TIN & TIN-LEAD PLATING. PART I - ACID TIN.
Hirsch, Stanley
Metal Finishing, 1984, 82 (10) : 31 - 33
[24] THE LOW TEMPERATURE PROPERTIES OF TIN AND TIN-LEAD ALLOYS
KALISH, HS
DUNKERLEY, FJ
TRANSACTIONS OF THE AMERICAN INSTITUTE OF MINING AND METALLURGICAL ENGINEERS, 1949, 180 : 637 - 656
[25] INVESTIGATIONS ON VACUUM DEZINCING OF TIN AND TIN-LEAD ALLOYS
KAMMEL, R
MIRAFZAL.H
RAMSL, R
METALL, 1974, 28 (09): : 889 - 895
[26] Tin-lead plating on encapsulated semiconductor lead frames
Foppen, Robert, 1600, (91):
[27] STUDIES ON THE BRIGHT TIN-LEAD PLATING PROCESS
ZHANG, LM
YE, JD
XIONG, G
PLATING AND SURFACE FINISHING, 1987, 74 (05): : 44 - 44
[28] Operating tips for tin-lead fluoborate plating
Met Finish, 1 (38):
[29] INHIBITED ELECTROCRYSTALLIZATION OF TIN-LEAD ALLOYS
RAUB, E
ELSER, F
JOURNAL OF THE LESS-COMMON METALS, 1978, 62 (NOV-): : 431 - 445
[30] ELECTRODEPOSITION OF BRIGHT TIN-LEAD ALLOYS
SELIVANOVA, GA
TYUTINA, KM
ANTONOVA, IA
PETRASHKINA, NA
PROTECTION OF METALS, 1993, 29 (01): : 133 - 135