The authors wish to thank Ohmega Technologies;
TAM ceramics;
Ciba-Geigy;
and Shipley Corporation for materials donation. The work was supported by National Science Foundation through the Georgia Tech/NSF Engineering Research Center in Electronic Packaging (NSF Contract No.: EEC-9402723). S. Bhattacharya wishes to thank Alan Krauss for his help in meniscus coating and Bruce Mahler of Ohmega Technologies for his recommendations in resistor fabrication;