MILITARY MICROCIRCUIT PACKAGING.

被引：0
作者：
Brauer, Joseph B.
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来源：
Electronic Engineer (Philadelphia) (Changed to EE/Systems Engineering today | 1972年 / 31卷 / 07期
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摘要：
This article discusses mechanical and environmental testing of microcircuit packages, internal atmospheres of microcircuit packages and plastic encapsulated devices.
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页码：30 / 31
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