MILITARY MICROCIRCUIT PACKAGING.

被引：0
作者：
Brauer, Joseph B.
机构：
来源：
Electronic Engineer (Philadelphia) (Changed to EE/Systems Engineering today | 1972年 / 31卷 / 07期
关键词：
D O I：
暂无
中图分类号：
学科分类号：
摘要：
This article discusses mechanical and environmental testing of microcircuit packages, internal atmospheres of microcircuit packages and plastic encapsulated devices.
引用
收藏
页码：30 / 31
相关论文
共 50 条
[31]   DNA condensation and viral packaging. [J].
Gelbart, WM .
ABSTRACTS OF PAPERS OF THE AMERICAN CHEMICAL SOCIETY, 2001, 221 :U248-U248
[32]   STRESS ANALYSIS IN ELECTRONIC PACKAGING. [J].
Engel, P.A. ;
Lim, C.K. .
Finite elements in analysis and design, 1988, 4 (01) :9-18
[33]   PLASTICS AND METALS: CHOICES IN PACKAGING. [J].
Heathcoat, M.J. .
Sheet Metal Industries, 1988, 65 (05) :251-252
[34]   PHYSICAL DESIGN AND PACKAGING - 4. MATERIALS FOR PACKAGING. [J].
Brooks, Phil .
EDN, 1973, 18 (20) :56-61
[35]   6 HOTTEST TRENDS IN FOOD PACKAGING. [J].
Bertrand, Kate .
Packaging Boston, Mass., 1986, 31 (01) :24-30
[36]   Acrylonitrile Copolymers for Food Product Packaging. [J].
Eagleton, S.D. .
1978, 25 (02) :33-39
[37]   IMPROVED BARRIER PROPERTIES FOR FLEXIBLE PACKAGING. [J].
Anon .
Packaging Boston, Mass., 1986, 31 (03) :72-74
[38]   Plastics in packaging. An environmental law perspective [J].
Garg, S.K. .
Polymer Preprints, Division of Polymer Chemistry, American Chemical Society, 1993, 34 (01)
[39]   Metallized Plastics Films for Food Packaging. [J].
Dulin, Cyril I. .
Kunststoffe Plastics Monatliche Ausg., 1984, 31 (03) :12-15
[40]   SURFACE-MOUNTED SEMICONDUCTOR PACKAGING. [J].
Marston, Peter .
New Electronics, 1983, 16 (09)
12345