Effect of active metal on bonding characteristics and interfacial structure of the Si3N4/Si3N4 joints brazed by Ag-Cu filler metal

被引：0
作者：
Morizono, Yasuhiro [1 ]
Nakata, Takashi [1 ]
Nishida, Minoru [1 ]
Chiba, Akira [1 ]
机构：
[1] Kumamoto Univ, Kumamoto-shi, Japan
来源：
Nippon Seramikkusu Kyokai Gakujutsu Ronbunshi/Journal of the Ceramic Society of Japan | 1995年 / 103卷 / 1200期
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页码：810 / 815
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