Al-Cu alloy etching using in-reactor aluminium chloride formation in static magnetron triode reactive ion etching

被引：0

作者：

Sato, Masaaki ^{[1
]}

Arita, Yoshinobu ^{[1
]}

机构：

[1] NTT LSI lab, Kanagawa, Japan

来源：

Japanese Journal of Applied Physics, Part 1: Regular Papers and Short Notes and Review Papers | 1993年 / 32卷 / 6 B期

关键词：

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摘要：

引用

页码：3013 / 3018

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[31] FABRICATION OF DEEP SUBMICRON PATTERNS WITH HIGH ASPECT RATIO USING MAGNETRON REACTIVE ION ETCHING AND SIDEWALL PROCESS [J].

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[33] The Role of Reactive Ion Etching(RIE) on Wirebond Formation: A Study on Successful Rate of Thermosonic Gold Wire on Aluminium Bondpad [J].

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[34] INVESTIGATION OF THE DEPENDENCE OF REACTIVE ION ETCHING OF AL-SI-CU ALLOYS UPON FILM DEPOSITION CHARACTERISTICS [J].

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[35] Controllable silicon nano-grass formation using a hydrogenation assisted deep reactive ion etching [J].

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