VLSI PACKAGING AND ASSEMBLY.

被引：0
|
作者：
Braden, Jeffrey S. [1 ]
机构：
[1] Indy Electronics Inc, Manteca, CA,, USA, Indy Electronics Inc, Manteca, CA, USA
来源：
Semiconductor International | 1988年 / 11卷 / 01期
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摘要：
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页码：58 / 61
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