Interfacial energy and wetting of Cu/Sn-Pb alloy

被引:0
|
作者
Sasabe, Ken [1 ]
Ohashi, Osamu [1 ]
机构
[1] National Research Inst for Metals
关键词
Halo - Tin lead alloys - Work of spreading;
D O I
暂无
中图分类号
学科分类号
摘要
引用
收藏
页码:405 / 409
相关论文
共 50 条
  • [41] Effect of permanent magnet stirring on solidification of Sn-Pb alloy
    Zeng, Jie
    Chen, Weiqing
    Yan, Wei
    Yang, Yindong
    McLean, Alex
    MATERIALS & DESIGN, 2016, 108 : 364 - 373
  • [42] Heterogeneous nucleation and solidification prediction of Sn-Pb alloy droplets
    Wu, P
    Tian, YL
    Jiang, EY
    Tang, WC
    Fukuda, H
    Ando, T
    CHINESE JOURNAL OF CHEMICAL PHYSICS, 2004, 17 (04) : 471 - 475
  • [43] INFLUENCE OF NOTCH SHAPE ON ELONGATION IN A SN-PB SUPERPLASTIC ALLOY
    TOZAWA, T
    KATO, H
    TAKAYAMA, Y
    FURUSHIRO, N
    HORI, S
    JOURNAL OF THE JAPAN INSTITUTE OF METALS, 1985, 49 (08) : 614 - 619
  • [44] Production and characterization of mono sized Sn-Pb alloy balls
    Yim, P
    Chun, JH
    Ando, T
    Sikka, VK
    INTERNATIONAL JOURNAL OF POWDER METALLURGY, 1996, 32 (02): : 155 - &
  • [45] Thermally Activated Deformation of an Eutectic Sn-Pb Alloy.
    Kutschej, Robert
    Pink, Erwin
    Stuewe, Hein Peter
    Zeitschrift fuer Metallkunde/Materials Research and Advanced Techniques, 1980, 71 (10): : 666 - 672
  • [46] Interfacial reactions between eutectic Sn-Pb solder and Co substrate
    Wang, Chao-hong
    Kuo, Chun-yi
    JOURNAL OF MATERIALS SCIENCE, 2011, 46 (08) : 2654 - 2661
  • [47] Electromigration in Sn-Pb solder strips as a function of alloy composition
    Liu, CY
    Chen, C
    Tu, KN
    JOURNAL OF APPLIED PHYSICS, 2000, 88 (10) : 5703 - 5709
  • [48] A DETERMINATION OF INTERFACIAL ENERGY AND INTERFACIAL COMPOSITION IN CU-PB AND CU-PB-X ALLOYS BY SOLID-STATE WETTING MEASUREMENTS
    RAO, G
    ZHANG, DB
    WYNBLATT, P
    ACTA METALLURGICA ET MATERIALIA, 1993, 41 (11): : 3331 - 3340
  • [49] Comparative study of wetting behavior and mechanical properties (microhardness) of Sn-Zn and Sn-Pb solders
    Adnan Islam, Rashed
    Chan, Y. C.
    Jillek, W.
    Islam, Samia
    MICROELECTRONICS JOURNAL, 2006, 37 (08) : 705 - 713
  • [50] Interfacial Reactions in Sn-Pb/Ni-8.0 at.%V Couples
    Sinn-wen Chen
    Yu-ren Lin
    Hsin-jay Wu
    Ru-Bo Chang
    Journal of Electronic Materials, 2011, 40 : 1527 - 1532