From thick film hybrid circuits to multichip modules

被引：0

作者：

Rappold, H.M. ^{[1
]}

Ryckebusch, M. ^{[1
]}

Stark, M. ^{[1
]}

机构：

[1] Alcatel SEL Nuernberg, Germany

来源：

Alcatel Telecommunications Review | 1996年 / 2 nd Quarter期

关键词：

D O I：

暂无

中图分类号：

学科分类号：

摘要：

引用

页码：110 / 113

共 50 条

[31] THICK-FILM HYBRID CIRCUITS CHARACTERISTICS, MANUFACTURE AND APPLICATION.
Vogel, P.
Hasler review, 1980, 13 (3-4): : 38 - 47
[32] DIPLOG - A NEW RANGE OF THICK-FILM HYBRID INTEGRATED CIRCUITS
GREENWELL, AW
INDUSTRIAL ELECTRONICS, 1968, 6 (04): : 143 - +
[33] HYBRID THICK - FILM CIRCUITS. THEIR DESIGN, APPLICATION AND MANUFACTURE.
Brooke, G.
Baldwin, W.E.B.
Wireless World, 1973, 79 (1449): : 121 - 125
[34] OPTIMIZATION OF THIN AND THICK-FILM TECHNOLOGY FOR HYBRID MICROWAVE CIRCUITS
MEINEL, H
REMBOLD, B
WIESBECK, W
ELECTROCOMPONENT SCIENCE AND TECHNOLOGY, 1977, 4 (3-4): : 143 - 146
[35] ULTRA-FINE FEATURE PRINTED-CIRCUITS AND MULTICHIP MODULES
CHANDLER, N
TYLER, SG
GEC JOURNAL OF RESEARCH, 1994, 11 (02): : 90 - 98
[36] MICROMINIATURE THICK FILM CIRCUITS
TRAMPOSC.RF
AMERICAN CERAMIC SOCIETY BULLETIN, 1969, 48 (04): : 428 - &
[37] THICK-FILM CIRCUITS
ISERT, H
ELEKTROTECHNISCHE ZEITSCHRIFT B-AUSGABE, 1972, 24 (04): : 85 - &
[38] MULTICHIP MODULES
BRUCE, RH
MEULI, WP
HO, J
26TH ACM/IEEE DESIGN AUTOMATION CONFERENCE, 1989, : 389 - 393
[39] ULTRA-FINE FEATURE PRINTED-CIRCUITS AND MULTICHIP MODULES
CHANDLER, N
TYLER, SG
MICROELECTRONICS JOURNAL, 1995, 26 (04) : 393 - 404
[40] NEW INTERCONNECTION TECHNIQUES FOR MULTICHIP + HYBRID INTEGRATED CIRCUITS
SANDBANK, CP
MCKEOWN, PJA
PROCEEDINGS OF THE IEEE, 1964, 52 (12) : 1655 - &